Thursday, December 14, 2006

Tessera Introduces a New Thinner Wafer-Level Chip-Size Packaging

Advanced Imaging Pro: Tessera Technologies announced SHELLCASE(R) RT, one of the world's thinnest, wafer-level chip size packaging (WLCSP). As one of the thinnest WLCSPs on the market today (at ~500microns), SHELLCASE(R) RT enables very low profile camera modules.

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