Wednesday, March 15, 2017

SMIC Licenses Ziptronix Bonding Technology

BusinessWire: SMIC has executed a technology transfer and license agreement for Invensas’ Direct Bond Interconnect (DBI) technology. SMIC intends to offer this bonding technology to its image sensor manufacturing customers. Invensas is a wholly owned subsidiary of Xperi Corporation (former Tessera).

As one of the leading foundries, SMIC delivers advanced semiconductor manufacturing processes to device makers around the world, and we are pleased to integrate DBI technology into our capabilities,” said Tzu-Yin Chiu, CEO and Executive Director of SMIC. “This technology is a key enabler for the fabrication of 3D stacked image sensors, and by working closely with Invensas, we will accelerate the development and commercialization of a new generation of imaging products for our customers.

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